TOOL21156

MaAnt BGA Reballing Stencils For Samsung (S/Note/A Series)

Description

● High-quality steel sheet stencil, more durable
● Precise laser cutting for better alignment
● High-temperature resistance, not easy to get deformed
● The CPU and the common fault ICs are integrated into one stencil
● IC numbers are lasered on the stencil for reference, much easier to find

Additional information

Product type

BGA Chip Ball Template Stencil

Group brand

Repair Tools

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